Dicing Tape Model	UV/Non-UV	Applications & Properties
DX-TAD95C	UV	Use: Silicon Wafer Transparent, Highly expandable
DX-TAD95C-R	UV	Use: Silicon Wafer Transparent, Highly expandable RoHS2.0 compliant
DX-TADC-AS	UV	Use: Silicon Wafer Transparent, Highly expandable RoHS2.1 compliant ; Antistatic
DX-TAD85C-R	UV	Use: Silicon Wafer Prevent chipping; Support small chips; Highly expandable
DX-TAP100	UV	Packaging substrates. Glass
DX-TAU115	UV	Glass. Ceramics
DX-TAU125B	UV	Packaging substrates. Hard to cut surfaces. Strong adhesive
DX-TAB165C	UV	Packaging substrates Pevent chipping; Easily peeled by hand
DX-TAP165D	UV	Packaging substrates Strong adhesive; Prevent chipping
DX-TAP165E-AS	UV	Packaging substrates Strong adhesive; Prevent chipping; Antistatic
DX-TAP165	UV	Packaging substrates. Glass
DX-TAP175	UV	Packaging substrates. Glass
DX-TAP200	UV	Packaging substrates. Glass
DX-TAU213F	UV	Packaging substrates hard to cut surfaces. Glass lenses. Strong adhesive